#Blackwell

TSMC's Arizona Fab 21 has begun mass production of NVIDIA Blackwell wafers using the custom 4NP process, but these wafers must be shipped to Taiwan for CoWoS-L advanced packaging. This highlights a critical gap in the US semiconductor supply chain: while advanced logic fabrication is now possible domestically, the US still lacks high-volume advanced packaging and HBM memory capabilities, creating ongoing reliance on Taiwanese facilities and delaying full supply chain independence until at least 2028-2029. The 4NP process is a customized 4nm-class node for NVIDIA, and CoWoS-L combines chip-on-wafer-on-substrate with an RDL interposer and local silicon interconnect. Amkor, TSMC, and SK Hynix are building packaging and HBM capacity in the US, but these facilities are not yet operational.