Huawei reportedly asks Ascend 960DT buyers to source Samsung, SK Hynix HBM

The Information reported that Huawei has told some customers its next-generation flagship AI chip, Ascend 960DT, will rely mainly on Samsung and SK Hynix HBM and that those customers must source the memory themselves because Chinese HBM capacity is insufficient. The report also describes HBM being shipped into mainland China soldered to low-performance processors and declared under processor codes via Hong Kong, then removed; a Shenzhen chip broker cited by the report said a single HBM3E unit now costs about $4,000, up from a few hundred dollars a year earlier. These details are secondhand, and the smuggling and pricing claims were not independently verified in the supplied material.